Specification:
TEC1-03140T 125 3.5V 40A;
Size: 40mm×40mm;
Features:
No moving parts, noise-free operation, solid-state stable structure;
Integrated chip design, small size and light weight;
No environmental pollution;
Compliant with RoHS (Restriction of Hazardous Substances) standards;
Precise temperature control;
High performance, high reliability;
Application:
Small food storage refrigerator;
Car portable incubator;
Liquid cooling;
Thermostat control;
CPU and various scientific instruments to dissipate heat;
Electronics, biology and medicine;
Performance Specification
| 
       Hot surface temperature(℃)  | 
      
       27  | 
      
       50  | 
      
       The temperature of the hot surface in dry air or nitrogen environment  | 
    
| 
       Maximum temperature difference (ºC)  | 
      
       70  | 
      
       79  | 
      
       The temperature difference between the hot side and the cold side of the device when the cold output is 0  | 
    
| 
       Maximum load voltage (Voltage)  | 
      
       4.0  | 
      
       4.3  | 
      
       The voltage applied when the maximum temperature difference is reached  | 
    
| 
       Maximum through current (amps)  | 
      
       4.7  | 
      
       4.7  | 
      
       The current that passes when the maximum temperature difference is reached  | 
    
| 
       Maximum cooling power (Watts)  | 
      
       11.81  | 
      
       12.89  | 
      
       Cold production when the temperature difference is 0 °C  | 
    
| 
       AC resistance (ohms)  | 
      
       0.66  | 
      
       0.70  | 
      
       The device is based on the internal resistance under alternating current conditions  | 
    
| 
       Tolerance (%)  | 
      
       ±10  | 
      
       Based on thermal and electrical parameters  | 
    |
 
Manufacturing options:
A. Solder:
1. T100: Bismuth tin (BiSn) melting point 138 ºC;
2. T200: Copper tin (CuSn) melting point 227 °C B. Edge banding:
B.Edge banding;
1. NS: No edge banding (standard);
2. SS: Silicone;
C. Porcelain plate material:
1. Alumina (Al2O3, white 96%) (AlO);
2. Aluminum nitride (AlN);
3. EPS: Epoxy resin;
4. Special requirements customization;
D. Porcelain plate surface options:
1. Blank porcelain plate (no metallization)
2. Metallized porcelain plate (copper-clad);
Flatness / levelness options;
| 
       Subscript  | 
      
       Thickness ( mm)  | 
      
       Flatness/levelness  | 
      
       Lead length (mm) Standard/custom length  | 
    
| 
       TF  | 
      
       0:4.0 ± 0.1  | 
      
       0:0.05 / 0.05  | 
      
       125mm or customizing  | 
    
| 
       TF  | 
      
       1:4.0 ± 0.05  | 
      
       1:0.025 / 0.025  | 
      
       125mm or customizing  | 
    
| 
       TF  | 
      
       2:4.0 ± 0..025  | 
      
       2:0.015 / 0.015  | 
      
       125mm or customizing  | 
    
| 
       Eg. TF01: Thickness 4.0±0.1mm; Flatness/levelness 0.025mm/0.025mm;  | 
    |||
 
 
 
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